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Monolithic 3D - In General
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Part 1: Monolithic 3D - General
Chapter 1 - Is the Cost Reduction Associated with Scaling Over?
Chapter 2 - IEDM 2012 - The Pivotal Point for Monolithic 3D IC
Chapter 3 - The Monolithic 3D Advantage
Chapter 4 - How can 3D be cheaper? Isn't it twice the cost?
Chapter 5 - Obtaining Monocrystalline Semiconductor Layers for Monolithic 3D
Chapter 6 - Low Temperature Cleaving
Chapter 7 - Low Temperature Wafer Direct Bonding
Chapter 8 - How much does ion-cut cost?
Chapter 9 - Is MonolithIC 3D-IC less risky than scaling or TSV?
Chapter 10 - The Future is the Interconnect: IITC
Chapter 11 - Can Heat Be Removed from 3D-IC Stacks?
Chapter 12 - 3D NAND Opens the Door for MonolithIC 3D
Part 2: 3D-CMOS: Monolithic 3D Logic Technology
Chapter 13 – The Way and How of Fine-Grain 3D Integration
Part 3: 3D-FPGA: Monolithic 3D Programmable Logic
Chapter 14 – Three Dimensional FPGAs
Chapter 15 – Three Dimensional FPGAs – Part II
Part 4: 3D-Gate Array: Monolithic 3D Gate Array
Chapter 16 – Embedded Memory and MonolithIC 3D
Part 5: 3D-Repair: Yield recovery for high-density chips
Chapter 17 – Can Yield Increase with 3D Stacking?
Chapter 18 – Monolithic 3D IC Could Increase Circuit Integration by 1,000x
Chapter 19 – Repair in 3D Stack: The Path to 100% Yield with No Chip Size Limits
Part 6: 3D – DRAM: Monolithic 3D DRAM
Chapter 20 – Introducing our Monolithic 3D DRAM technology
Part 7: 3D – RRAM: Monolithic 3D RRAM
Chapter 21 – Introducing our Monolithic 3D Resistive Memory Architecture
Part 8: 3D – Flash: Monolithic 3D Flash Memory
MonolithIC 3D Inc.
, the Next-Generation 3D-IC Company, 2012 - All Rights Reserved, Patents Pending